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ST2349
2-bit dual supply level translator without control pin
Data Brief
Features

100 Mbps (typ.) data rate when driven by a totem pole driver 4 Mbps (typ.) data rate when driven by a Open Drain pole driver Bidirectional level translation, without direction pin Wide VL voltage range of 1.65V to 3.6V Wide VCC voltage range of 1.80V to 5.5V Power down mode feature - when either supply is off, all I/Os are in High Impedance. Low quiescent current (max 10A) Suitable to be driven by Totem Pole and Open Drain driver. 5.5V tolerant enable pin ESD Performance on all Pins : 2kv HBM Small package and footprint QFN10 ( 1.8 x 1.4 mm ) package
QFN16L (2.6mm x 1.8mm)
Description
ST2349 is a level translator providing level shifting necessary to allow data transfer in a multi-voltage system. Externally applied voltages, VCC and VL, set the logic levels on either side of the device. It utilizes transmission gate based design that allows bidirectional level translation without control pin. The ST2349 accepts VL from 1.65V to 3.6V and VCC from 1.80V to 5.5V, making it ideal for data transfer between low-voltage ASICs /PLD and higher voltage system. This device has threestate output mode that disables all I/Os. ST2349 supports power-down mode at either of its supply (VL or VCC) where it will disable all I/Os when one of the supply is off. This feature will protect the device from current backflow through the device.
Application

Low voltage system level translation Mobile phone Other mobile devices I2C level translation UART level translation
Table 1.
Device summary
Part number ST2349QTR Package QFN16L (2.6mm x 1.8mm) Packaging Tape and Reel (3000 parts per reel)
May 2007
Rev 1
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www.st.com 6
For further information contact your local STMicroelectronics sales office.
Package mechanical data
ST2349
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com Table 2. QFN16L (2.6x1.8mm) mechanical data
mm. Dim. Min A A1 b D E e L 0.35 0.45 0 0.15 2.50 1.70 Typ 0.55 0.02 0.20 2.60 1.80 0.40 0.40 0.45 Max 0.60 0.05 0.25 2.70 1.90
Note:
1 2 3 4 5
VFQFPN - Standard for thermally enhanced vey fine pitch quad flat package no leads. The leads size is comprehensive of the thickness of the leads finishing material. Dimensions do not include mold protusion. Package outline exclusive of metal burrs dimensions. Shipping media tape and reel units: 3000 Figure 1. Foot print recommendation
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ST2349 Figure 2. Package information
Package mechanical data
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Package mechanical data
ST2349
Figure 3.
TSSOP24 tape & reel
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ST2349
Revision history
1
Revision history
Table 2.
Date 07-May-2007
Revision history
Revision 1 First release Changes
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ST2349
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